Technic Asia-Pacific

Technic Asia-Pacific Pte Ltd is a regional office of a global manufacturer.

Enterprise Introduction:

Technic Asia-Pacific Pte Ltd is the Singapore-based regional headquarters for Technic Inc., a globally recognized leader in the development and manufacturing of specialty chemicals, advanced electroplating equipment, and engineered products. The company serves a diverse range of critical industries including semiconductor fabrication, printed circuit board (PCB) manufacturing, general industrial finishing, and decorative applications.

As an integral part of Technic's worldwide network, Technic Asia-Pacific acts as the direct link to the parent company's extensive manufacturing capabilities, proprietary technologies, and cutting-edge research and development. Its primary role in the Asia-Pacific region involves sales, distribution, technical service, and customer support, ensuring that clients receive expert assistance and direct access to Technic's high-quality, manufactured solutions for their complex surface finishing and processing requirements.

Technic Asia-Pacific in Singapore manufactures or sells a comprehensive range of products and solutions primarily for the semiconductor, printed circuit board, industrial, and decorative finishing industries.

Key product categories include:

Electroplating Chemicals

Precious Metal Plating solutions including Gold, Silver, Platinum, Palladium, Rhodium, and Ruthenium.

Non-Precious Metal Plating solutions including Nickel, Copper, Tin, Tin-Lead, Zinc, and Chromium.

Alloy Plating solutions.

Electroless Plating solutions such as Electroless Nickel and Electroless Copper.

Surface Finishing Solutions including Cleaners, Activators, Etchants, Strippers, and Passivates.

Pre-treatment and Post-treatment chemicals for various applications.

Electroplating Equipment

Automated Plating Systems for Reel-to-Reel, Barrel, and Rack plating lines.

Chemical Process Control Systems for precise bath management.

Rectifiers and Power Supplies.

Filtration and Pumping Systems.

Wastewater Treatment Systems for environmental compliance.

Products for Semiconductor Applications

Wafer Level Packaging (WLP) plating chemicals and equipment.

Bump Plating solutions for Copper, Nickel, Tin-Silver, and Gold.

Through Silicon Via (TSV) plating processes.

Lead Frame Plating solutions.

Products for Printed Circuit Board (PCB) Applications

Electrolytic Copper Plating processes.

Electroless Copper Plating processes.

Direct Metallization processes.

Final Surface Finishes including Electroless Nickel Immersion Gold (ENIG), Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), Immersion Tin, Immersion Silver, and Organic Solderability Preservatives (OSP).

Desmear and Etching chemicals.

Anodes

Soluble and Insoluble Anodes for various plating processes.