Company Profile:
ROHM&HAAS ELECTRONIC MATERIALS in Taiwan is primarily a manufacturing facility, also acting as a direct supplier.
Company Introduction:
ROHM&HAAS ELECTRONIC MATERIALS, now a significant part of Dow Chemical Company, is a leading provider of advanced materials for the electronics industry. In Taiwan, the company operates as a key manufacturing site and supplier, producing a wide range of specialized chemicals, polymers, and formulations. These essential materials are crucial for the fabrication of semiconductors, printed circuit boards (PCBs), displays, and various other electronic components.
The company plays a vital role in supporting Taiwan's robust electronics manufacturing sector, which is a global leader in semiconductor and high-tech production. ROHM&HAAS ELECTRONIC MATERIALS Taiwan provides not only high-quality products but also offers technical expertise and solutions to its customers, contributing significantly to the innovation and advancement of the global electronics supply chain. Its operations include manufacturing, research and development, sales, and comprehensive technical support.
Enterprise Products
ROHM AND HAAS ELECTRONIC MATERIALS TAIWAN PRODUCTS
1. ELECTROPLATING CHEMICALS
Copper, tin, silver, and gold plating solutions for printed circuit board and semiconductor packaging applications.
2. PHOTORESISTS
Advanced photoresist materials and ancillary chemicals used in microlithography for semiconductor manufacturing.
3. DIELECTRIC MATERIALS
Specialty insulating materials for integrated circuits and electronic components.
4. CHEMICAL MECHANICAL PLANARIZATION (CMP)
Slurries and pads used for polishing semiconductor wafers.
5. PACKAGING AND ASSEMBLY MATERIALS
Adhesives, encapsulants, and underfill materials for semiconductor device protection and connectivity.
6. METAL FINISHING TECHNOLOGIES
Surface treatment chemicals for connectors, lead frames, and other electronic components.
7. PRINTED CIRCUIT BOARD (PCB) PROCESSING CHEMICALS
Materials for desmearing, through-hole plating, and surface finishing of high-density interconnect boards.