UNISEMS M. BERHAD C.O. INTERNATIONA

Nature of Business: Manufacturer (Factory)

Company Profile:

Unisem (M) Berhad is a globally recognized semiconductor assembly and test services provider. Founded in 1989 and headquartered in Malaysia, the company operates as a major Outsourced Semiconductor Assembly and Test (OSAT) provider. It specializes in providing comprehensive semiconductor packaging and testing services, including wafer bumping, wafer probing, wafer grinding, and various types of integrated circuit packaging. The company serves a diverse portfolio of customers, including many of the world's leading electronics and semiconductor companies, across industries such as automotive, communications, computing, and consumer electronics. Unisem operates extensive manufacturing facilities in Malaysia (Ipoh) and China (Chengdu), maintaining high standards of quality control and technological innovation in semiconductor manufacturing.

Unisem M. Berhad is a global provider of semiconductor assembly and test services. The company does not manufacture end-user consumer products but provides manufacturing solutions for semiconductor devices. Its primary service offerings and product-related capabilities include:

1. Wafer Bumping

2. Wafer Probing

3. Package Assembly (including leadframe-based and substrate-based packages)

4. Final Test Services

5. Advanced Packaging Solutions (such as Flip Chip, Wafer Level Chip Scale Packaging, and System-in-Package)

6. RF, Analog, Digital, and Mixed-Signal Device Testing

These services are utilized by customers in industries such as automotive, telecommunications, computing, and consumer electronics to produce integrated circuits and semiconductor components.