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BONDTEC PACIFIC COMPANY LTD

Company Profile:



Business Type: Manufacturer (Factory)

Company Profile:

BONDTEC PACIFIC COMPANY LTD is a professional manufacturer specializing in the research, development, and production of high-precision bonding equipment and semiconductor assembly solutions. The company is dedicated to providing advanced micro-joining technology and automated packaging systems for the global electronics and semiconductor industries. With a focus on engineering excellence and technical innovation, Bondtec Pacific offers a comprehensive range of wire bonders and related assembly machinery designed to meet the rigorous quality standards of modern manufacturing. Through its commitment to precision and reliability, the company serves as a key supplier for high-tech industrial applications, ensuring efficient and stable production processes for its clients worldwide.

Enterprise Products

BONDTEC PACIFIC COMPANY LTD products include the following:

1. Wire Bonding Equipment: Automatic and semi-automatic wire bonders for semiconductor assembly.

2. Die Bonding Equipment: Die attach systems for various chip packaging applications.

3. Semiconductor Packaging Tools: Specialized tools and accessories for wire and die bonding processes.

4. Ultrasonic Generators and Transducers: Components used in bonding systems.

5. Customized Bonding Solutions: Tailored equipment configurations to meet specific manufacturing requirements.

6. Spare Parts and Consumables: Replacement components and maintenance items for bonding machinery.

7. Technical Support and Service: After-sales support, installation, and maintenance services for their equipment.

Business Registration Information:

Manager:

Mr. C. H. Chen (President)

Phone:

+886-2-2696-1899

E-mail:

sales@bondtec.com.tw

Official Website:
Address:

6F-1, No. 100, Sec. 1, Xintai 5th Road, Xizhi District, New Taipei City 221, Taiwan (R.O.C.)

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