MIBK Standard for Particle Residue Control in Semiconductor Packaging Materials Cleaning?

With the rapid development of the semiconductor industry, the cleaning technology of packaging materials is also improving. As an efficient organic solvent, MIBK (methyl isobutyl ketone) is widely used in the cleaning of semiconductor packaging materials. This article will analyze the particle residue control standard of MIBK in the cleaning process in detail, and help the relevant industry personnel to better understand and apply this technology.

Advantages of MIBK in semiconductor packaging material cleaning

MIBK has good solubility and chemical stability, and is particularly suitable for cleaning organic contaminants in semiconductor packaging materials. It can effectively remove residual photoresist, residual organic film and other contaminants, while the material surface damage is small. Compared with other cleaning solvents, MIBK is less volatile and reduces solvent loss in the cleaning process, so it is more economical in industrial applications.

Sources and effects of particle residues

in the MIBK cleaning process, the particle residue mainly comes from the following aspects:

1. cleanliness of cleaning equipment: Cleaning equipment such as tanks, spray systems, etc., if not cleaned thoroughly, may introduce particulate contaminants, resulting in residual particles on the surface of the cleaned packaging material.
2. Purity of MIBK: If MIBK itself contains impurities or particles, it will be directly transferred to the surface of the packaging material during the cleaning process, affecting the cleaning effect.
3. Environmental factors dust, aerosols, etc. in the cleaning environment may also enter the cleaning fluid, causing particle residues.

The influence of particle residues on semiconductor packaging materials cannot be ignored. The remaining particles may cause surface defects, resulting in open circuit, short circuit and other problems in the subsequent use of the packaging material, thereby reducing the reliability and performance of the product. Therefore, strict control of particle residue is the key to ensure product quality.

Control standard of particle residue

in order to ensure the effectiveness of MIBK cleaning, the industry usually establishes control standards for particle residues. These criteria are typically evaluated quantitatively based on the size and number of particles. For example, it is generally required that the number of particles having a diameter greater than 0.5 μm on the surface of the packaging material after cleaning should be controlled to not more than 100 per square centimeter, while the number of particles having a diameter greater than 1 μm should be further reduced to not more than 50 per square centimeter.

monitoring and control countermeasures

in order to achieve the above control standards, enterprises need to take the following measures:

1. strictly control the purity of MIBK: Use high-purity MIBK and check its purity regularly to ensure that no impurities are introduced.
2. Optimize cleaning equipment: Use efficient cleaning equipment, and regular cleaning and maintenance to avoid the accumulation of pollutants inside the equipment affecting the cleaning effect.
3. Establish a strict monitoring system: Real-time monitoring of the cleaned packaging materials through equipment such as particle counters to ensure that the particle residues meet the standards.
4. Optimization of cleaning process: By adjusting the cleaning time, temperature, pressure and other process parameters, optimize the cleaning effect and reduce the possibility of residual particles.

Conclusion

MIBK particle residue control in semiconductor packaging material cleaning is a complex and critical process. Only through strict control standards and scientific monitoring methods can we ensure that the cleaning effect meets the requirements of the industry, thereby improving product quality and market competitiveness. With the continuous advancement of technology, the control of particle residues in MIBK cleaning will be more accurate and efficient in the future, providing stronger support for the development of the semiconductor industry.