Methyl methacrylate in semiconductor packaging emerging applications

With the development of the semiconductor industry, packaging technology plays a vital role in ensuring chip performance and reliability. Methyl methacrylate (MMA), as an acrylate monomer with excellent performance, has shown its unique advantages in the field of semiconductor packaging in recent years, especially with the promotion of high density, miniaturization and high-performance packaging requirements, the application of MMA is gradually expanding.

Methyl methacrylate basic characteristics and packaging material requirements

Methyl methacrylate is a colorless liquid with good chemical and thermal stability. Its monomer structure determines that the acrylic resin prepared by it has the characteristics of low dielectric constant, high thermal conductivity, excellent moisture resistance and good processing performance, which make it an ideal choice for semiconductor packaging materials.

Semiconductor packaging materials need to meet a variety of performance requirements, including mechanical properties, electrical insulation properties, thermal conductivity, and moisture and chemical resistance. Although traditional packaging materials such as epoxy resin and silicone perform well in some fields, with the continuous improvement of chip performance, these materials gradually expose the shortcomings of high dielectric constant and low thermal conductivity, which affect the packaging efficiency and reliability. Therefore, the search for new packaging materials has become an important issue in the industry.

Methyl methacrylate in semiconductor packaging applications

1. Package substrate material

The package substrate is one of the core structures of the semiconductor package, and its main function is to provide support and electrical connection for the chip. Methyl methacrylate can be used to prepare high-performance resins by free radical polymerization or other polymerization reactions for the preparation of packaging substrate materials. The resin prepared by MMA has a low dielectric constant and low moisture absorption, which can effectively reduce the loss during signal transmission and ensure the stability of the packaging substrate in a high humidity environment.

2. Packaging glue

Packaging adhesive is an indispensable material in semiconductor packaging, mainly used for bonding and protection between chips and substrates. Methyl methacrylate is widely used in the preparation of packaging adhesives because of its excellent adhesive properties and heat resistance. Compared with the traditional epoxy resin encapsulation adhesive, the encapsulation adhesive prepared by MMA has higher thermal conductivity and lower dielectric constant, which can effectively improve the heat dissipation performance and signal transmission efficiency of the package.

3. conformal coating material

Conformal coating is a surface protection technology in semiconductor packaging, which is mainly used to prevent the chip from being eroded by the external environment during use. Methyl methacrylate can be used to prepare conformal coating materials with good moisture resistance and chemical stability, and can maintain its excellent protective performance in high temperature and high humidity environments, thereby improving the reliability and service life of the package.

APPLICATION OF METHYL METHACRYLATE IN ADVANCED PACKAGE TECHNOLOGY

With the continuous development of semiconductor technology, advanced packaging technologies such as fan-out packaging (Fan-Out) and 3D packaging (3D Integration) have gradually become mainstream. These technologies put forward higher requirements for packaging materials, including smaller line width, higher integration and better heat dissipation performance. With its excellent material properties, methyl methacrylate is playing an important role in these advanced packaging technologies.

In fan-out packages, MMA-made resins can be used to make package substrate materials with low dielectric constants, thereby reducing crosstalk and delay during signal transmission. Its excellent thermal conductivity also helps to solve the heat dissipation problem caused by high-density packaging. In 3D packaging, materials prepared by MMA can be used to prepare interface materials with high thermal conductivity, effectively alleviate the thermal stress problem caused by chip stacking, and improve the reliability and performance of the package.

Methyl methacrylate in semiconductor packaging in the future

With the increasing demand for high-performance packaging materials in the semiconductor industry, the application of methyl methacrylate has broad prospects. It still needs to overcome some challenges in practical application, such as high material cost and complex preparation process. In the future, by optimizing the synthesis process of MMA and developing new modification technology, it can further improve its application performance in the field of packaging, reduce production costs, and promote its wide application in semiconductor packaging.

With its unique material properties, methyl methacrylate has shown great potential in the field of semiconductor packaging. With the continuous advancement of technology and in-depth exploration of applications, MMA is expected to occupy a more important position in the development of future semiconductor packaging materials, providing strong support for high-density, miniaturization and high-performance packaging requirements.