Mitsubishi Chemical to establish new commercial production facilities for ultra-high-purity colloidal silica

By SKYSEVEN Chemical Technical Team · 2026-08-21

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Mitsubishi Chemical Corp. (Tokyo, Japan) has announced plans to commercialize ultra-high-purity colloidal silica for use as a raw material for polishing agents in cutting-edge semiconductors. The company plans to establish new production facilities at its Kyushu Plant (Fukuoka Area) in Kitakyushu City, Fukuoka Prefecture, and begin commercial operations in October 2028.

Colloidal silica is utilized as a raw material to surface polishing agents to silicon wafers and as a raw material to chemical mechanical polishing (CMP) slurries utilized on the interconnect layers of silicon wafers. When polishing the wiring layers of silicon wafers, it is necessary to achieve high material removal rates while simultaneously flattening the surface at the nanoscale, ensuring the absence of impurities, and minimizing scratches; the appropriate shape and physical characteristics of colloidal silica particles vary depending on the material being polished.

The ultra-high-purity colloidal silica that Mitsubishi Chemical Corp. (Tokyo, Japan) is commercializing is produced through an integrated manufacturing process using an ultra-high-purity raw material — tetramethoxysilane — that minimizes impurity content. Drawing on cutting-edge technical expertise cultivated over many years, parameters such as particle size and density can be customized to meet customers’ needs.

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