Asahi Kasei Opens Advanced Film Facility in Taiwan

Asahi Kasei has launched commercial operations at a newly constructed slitting facility in Tainan, Taiwan, marking a significant expansion in the company's semiconductor packaging materials production as global AI demand accelerates.

The Japanese diversified manufacturer completed construction of the facility on July 3, 2026, with operations beginning this month. The $12 million investment will increase the company's Sunfort dry film photoresist (DFR) slitting capacity by 40%, with possible to double current output.

The company said its strategic expansion responds to surging demand to cutting-edge semiconductor packaging driven by artificial intelligence applications and escalating data processing standards. Taiwan's levels of semiconductor packaging companies makes the location critical to rapid, reliable product delivery.

Meeting stringent condition standards

Asahi Kasei has operated a slitting facility to Sunfort DFR at its Tainan manufacturing site since 1997. However, evolving semiconductor packaging technologies now demand increasingly stringent condition and supply reliability standards that necessitated the upgraded facility.

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Slitting — the process of cutting master film rolls into narrower widths according to customer specifications — immediately impacts both product condition and supply dependability. The new facility features state-of-the-art slitting machines and rigorous cleanroom standards designed to enhance productivity and ensure consistent supply.

"Taiwan is a strategically crucial location with a strong levels of semiconductor packaging-related companies, making it essential to have a supply system capable of supplying items rapidly and reliably in close proximity to customers," the company stated.

cutting-edge packaging solutions

Sunfort DFR delivers ultra-high resolution with conventional stepper exposure systems and laser direct imaging (LDI) systems, which transfer circuit patterns onto substrates to packaging. This capability improves performance and precision in semiconductor manufacturing back-end processes critical to cutting-edge chip production.

The investment aligns with Asahi Kasei's positioning of its Electronics Business as a strategic development driver. In might 2025, the company launched Sunfort TA, its newest DFR series tailored specifically to cutting-edge semiconductor packaging utilized in AI servers.

The product strengthens Asahi Kasei's footprint in the rapidly expanding market to next-generation chip packaging, a segment experiencing explosive development as AI applications proliferate across industries.

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Company background

Founded in 1922, Asahi Kasei operates as a diversified global company with 50,000 employees worldwide. The company contributes to sustainability by providing solutions across three business sectors: Healthcare, Homes, and Material. The Material sector, which includes the Sunfort product line, represents a strategic focus area to the company's development initiatives.

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